Email this Article Email   

CHIPS Articles: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases

Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases
NIST White Paper Open for Comment
By CHIPS Magazine - May 1, 2020
In today’s cloud data centers and edge computing environment, attack surfaces have significantly increased, hacking has become industrialized, and most security control implementations are not coherent or consistent, wrote National Institute of Standards and Technology officials in a release. The foundation of any data center or edge computing security strategy should be securing the platform on which data and workloads will be executed and accessed, officials recommended.

The physical platform represents the first layer for any layered security approach and provides the initial protections to help ensure that higher-layer security controls can be trusted. The NIST white paper, Hardware-Enabled Security for Server Platforms: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases, explains hardware-based security techniques and technologies that can improve platform security and data protection for cloud data centers and edge computing.

NIST requests comments on the Draft Cybersecurity White Paper, Hardware-Enabled Security for Server Platforms: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases. The public comment period for this document is open through June 2, 2020. See the publication details for a copy of the document and instructions for submitting comments. Please email comments to: hwsec@nist.gov

Related CHIPS Articles
Related DON CIO News
Related DON CIO Policy

CHIPS is an official U.S. Navy website sponsored by the Department of the Navy (DON) Chief Information Officer, the Department of Defense Enterprise Software Initiative (ESI) and the DON's ESI Software Product Manager Team at Space and Naval Warfare Systems Center Pacific.

Online ISSN 2154-1779; Print ISSN 1047-9988
Hyperlink Disclaimer